SPE COURSE: Advanced Thermal Packaging Using Phase Change Materials

Course

Advanced Thermal Packaging Using Phase Change Materials

May 12, 2025
11:00 AM to 12:00 PM EDT.
Online

Summary

This course discusses the basics of phase change materials (PCMs) and their use in thermal packaging. The course content includes PCMs as heat storage materials for use in thermal packaging, the types of PCMs that are used, and the pros/cons of each type. The containment (encapsulation) of PCMs is also discussed, including both micro- and macro- encapsulation techniques, as well as the methods commonly utilized to characterize their thermophysical and mechanical properties, which are required for successful numerical simulation of PCMs in thermal packaging (conjugate heat transfer). Numerical Simulation of Thermal Packaging is critical to reducing design time and cost. The specific techniques for macro encapsulation include both blow molded (rigid) polymeric containers as well as flexible film packaging, and material compatibility concerns. Another important consideration is making certain that PCMs being used remain shape (or form stable) upon phase change. The methods used to make shape/form stable PCMs are also discussed, which include both physical and chemical gelation, along with corresponding advantages and disadvantages.

Agenda

May 12, 2025

Duration: 1 Hour

Resources

Go to Session 1

If you can't attend one or several sessions live, or if you want to review some concepts, the recordings will be available after each session.

Registration Information

SPE Premium Member	FREE
SPE Members	$49
Nonmembers	$249

Not an SPE member? Join today and attend this workshop at a discounted rate!

1 Session

Level: Intermediate

Total Hours: 1 Hour

Streaming access on desktop and mobile browsers

Instructor

Richard Formato
Director of Research and Development
Microtek Laboratories, Inc.
LinkedIn

(Click for more information)

Richard M. Formato is a Subject Matter Expert on macroencapsulation, gelation and shape stability of organic Phase Change Materials (PCMs). He has expertise in packaging PCMs using vertical/horizontal form fill and seal (VFFS/HFFS) machinery, which includes the flexible films needed to manufacture PCM filled pouches as well as required destructive and non-destructive test methods. At Microtek Laboratories, Mr. Formato led the development and launch of multiple new products including a +3°C PCM, a +4°C PCM (PT4 replacement) and a +24°C PCM for the Adaptek 365 CRT product line. He leads the development activities of a +7°C PCM which allows a refrigerated shipper that can be pre-conditioning temperature of +5°C. Mr. Formato developed compostable PCM/water based refrigerants pouches for thermal packaging including degradable PCMs in fully compostable films which meet shelf life requirements. Mr. Formato invented and patented a formulation/method to gel organic PCMs using UV radiation in situ; this technique works w/n-alkanes, fatty acid methyl esters fatty alcohols and fatty acids. The 2nd generation refrigerants passed syneresis (< 1%wt loss) after 1000 freeze/thaw cycles. Mr. Formato led the scale-up for Shift Gen2 at HQ including pre-mix, final mix, and VFFS & UV cure at 20 BPM.

Previously, at Cold Chain Technologies, Mr. Formato was the company’s lead R&D/technical resource, whose contributions (simulation, liquid PCM and Gelled PCM) continue to be the driving force behind the Company's double digit sales growth year over year; Mr. Formato introduced all n-alkane PCMs into CCTs product line which comprised >33% of sales by the end of 2017; Mr. Formato invented novel formulations/processing methods (5 Issued US Patents) to gel CCT’s n-alkane PCMs so overall performance was significantly improved over liquid PCMs (won the 2016 Cold Chain Global Forum award for “Most Innovative New Cold Chain Technology.”). The scale-up and commercialization of Gelled PCM enabled the release of new products including ECOFLEX return/reuse thermal shippers and ENSHIELD pallet covers (8 patents / 1 pending).

Questions? Contact:

For questions, contact Iván D. López.

Who Should Attend?

This course is ideal for packaging professionals, packaging engineers, and packaging designers, as well as brands and logistics companies interested in thermal packaging solutions. It is particularly relevant for those focused on research, development, and engineering using phase change materials and/or thermal packaging technologies.

Participants may include scientists, engineers, R&D managers, and directors with backgrounds in polymers, materials, and thermal systems.

Why Should You Attend?

"Are you looking to understand the potential of phase change materials (PCMs) in thermal packaging?Whether you’re in packaging design, product development, or thermal management, mastering PCM technology is essential for creating efficient, reliable, and cost-effective thermal packaging solutions.

Struggling to select the right PCM for your thermal packaging applications?
This course provides a comprehensive overview of PCM types, their pros and cons, and the factors to consider when choosing the best material for your needs. Explore the fundamentals of micro- and macro-encapsulation techniques, along with practical methods for thermophysical and mechanical characterization.

Concerned about optimizing PCM performance and maintaining shape stability during phase change?
Learn about advanced techniques to ensure PCMs remain stable upon phase transition, including physical and chemical gelation methods. Discover the benefits and limitations of each approach to make informed decisions for your applications.

Want to reduce design time and costs through accurate numerical simulation of thermal packaging?
This course covers essential simulation techniques, including conjugate heat transfer analysis, to predict PCM behavior accurately. Gain insights into the specific methods used for blow-molded rigid containers, flexible film packaging, and considerations for material compatibility.

This Introduction to Phase Change Materials in Thermal Packaging course offers a deep dive into PCM fundamentals, encapsulation techniques, performance optimization, and simulation methodologies. Gain the expertise needed to leverage PCMs effectively in thermal packaging and achieve better temperature control, energy efficiency, and product reliability.